| 000 | 00569nam a2200193 4500 | ||
|---|---|---|---|
| 999 |
_c13423 _d13423 |
||
| 003 | OSt | ||
| 005 | 20230517122354.0 | ||
| 008 | 230517b ||||| |||| 00| 0 eng d | ||
| 020 | _a9781032160818 | ||
| 082 |
_a621.381046 _bC333T |
||
| 100 | _aCepeda-Rizo, Juan | ||
| 245 | _aThermal and structural electronic packeging analysis for space and extreme environments | ||
| 260 |
_aBoca Raton: _bCRC press, _c2022 |
||
| 300 | _axiii, 289 p. | ||
| 440 |
_a621.381046 _nC333T |
||
| 650 | _aArchitecture | ||
| 700 | _aGayle, Jereminah and Ravich, Joshua | ||
| 942 |
_2ddc _cBK |
||