Cepeda-Rizo, Juan <br/><br/>
Thermal and structural electronic packeging analysis for space and extreme environments 

 - Boca Raton:  CRC press,  2022 
 - xiii, 289 p. 
 - 621.381046  C333T .
<br/><br/><label>ISBN: </label>9781032160818 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Architecture
<br/><br/><label>Dewey Class. No.: </label>621.381046  / C333T