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Thermal and structural electronic packeging analysis for space and extreme environments

Cepeda-Rizo, Juan

Thermal and structural electronic packeging analysis for space and extreme environments - Boca Raton: CRC press, 2022 - xiii, 289 p. - 621.381046 C333T .

ISBN: 9781032160818

Subjects--Topical Terms:
Architecture

Dewey Class. No.: 621.381046 / C333T

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